Welcome to ELEXCON Shenzhen International Electronics Fair

2021-09-24 18:05
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On September 27-29, 2021, ELEXCON Shenzhen International Electronics Show will kick off at Shenzhen International Convention and Exhibition Center (Baoan New Hall). With the theme of "Smart World Starts Here! Towards Smart Design-Advanced Packaging and Testing-Supply Chain Upgrade-Ecosphere" Current industry hotspot technology new products and solutions such as new generation semiconductors, embedded systems, RISC-V, wearable technology, SiP and advanced packaging and testing, shared charging and replacement, and domestic chips.


Futurepath has been focusing on the research and development of solid-state storage technology and is a domestic professional service provider of intelligent test systems for flash memory chips. Through years of technical accumulation, the independent research and development of the flash memory chip intelligent test system has realized the reliability life prediction of the flash memory, made up for the difficult problems in the current NAND Flash test, and at the same time improved the identification ability and inspection efficiency of the NAND Flash quality. It provides reliable storage quality assurance for high-end industrial applications and fills the gap in this field in my country.


—— Intelligent test system for flash memory chips ——


At present, the domestic market does not have very clear specifications for the storage industry. In order to reduce costs, the quality of flash memory continues to decline, and the lifespan is getting lower and lower. The quality characteristics of the same batch of flash memory particles are not the same. The quality characteristics of the products to be stored vary.


It is in this industry environment that Futurepath invented life prediction technology and an intelligent test system for flash memory chips, which can accurately detect and analyze the quality of flash memory particles. Among the company’s current products, Futurepath’s test systems are available in portable, production, and research versions, and can meet the different needs of research institutes, manufacturers, testing centers, etc., and will continue to launch EMMC/UFS for embedded devices in the future. Wait for the test system.


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Time: September 27-29, 2021

Address: Shenzhen International Convention and Exhibition Center (Bao'an New Hall)

Booth number: Hall 7 7C32

We sincerely invite you to come!